Process Tools New Process ToolsLithography Photo Lithography - Mask Aligner(Karl Suss MA6 / BA6)Deep UV Lithography - Mask Aligner(Karl Suss MA6 / BA6)E-Beam Lithography - RAITHSubstrate Bonder - Karl Suss SB6Spin Coater - HOLMARCSpin Coater - SUSS Microtech Dry Etch Deep Reactive Ion etching (DRIE)ICPRIE (Cl2&BCl3)ICPRIE - (Cl2&HBr) Wet Processing HF Vapor EtcherWet bench solvent cleanConstant Temperature Bath (KOH)Wet bench Acid Clean DepositionDielectric Deposition Plasma Enhanced Atomic Layer Deposition (PEALD)ICP Plasma Enhanced Chemical Vapour Deposition (PECVD)LPCVD E-Beam Deposition E-Beam Metalization 1E-Beam Metalization 2 Sputter Deposition RF Sputtering (Minilab 060)RF Sputtering (HHV)Table Top RF Sputtering- Nano PVD 1Table Top RF Sputtering - Nano PVD 2DC Magnetron Sputtering-HHV Thermal Evaporator Thermal Metal EvaporationThermal Metal EvaporationThermal Evaporation Furnace Processing Oxidation FurnaceTempress FurnaceSVCS (4 Stack Furnace)Rapid Thermal Process (RTP) In-house DevelopmentIn-house Development Critical Point Dryer (CPD)
